NCP5230MNTWG datasheet(1/12 Pages) ONSEMI

Part #	NCP5230MNTWG

Description	Precise Low Voltage Synchronous Buck

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Manufacturer	ONSEMI [ON Semiconductor]

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January, 2013 − Rev. 1

1

Publication Order Number:

NCP5230/D

NCP5230

Precise Low Voltage

Synchronous Buck

Controller with Power

Saving Mode

The NCP5230 is a simple single phase solution with differential

phase current sensing, power saving operation, and gate drivers to

provide accurately regulated power.

The adaptive non overlap gate drive and power saving operation

circuit provide a low switching loss and high efficiency solution for

server, notebook, and desktop systems. A high performance

operational error amplifier is provided to simplify compensation of the

system. The NCP5230 features also include soft−start sequence,

accurate overvoltage and over current protection, UVLO for VCC and

VCCP, and thermal shutdown.

Features

• High Performance Operational Error Amplifier

• Internal Soft−Start/Stop

• ±0.5% Internal Voltage Accuracy, 0.8 V voltage reference

• OCP accuracy, Four Re−entry Times Before Latch

• “Lossless” Differential Inductor Current Sensing

• Internal High Precision Current Sensing Amplifier

• Oscillator Frequency Range of 100 kHz − 1000 kHz

• 20 ns Adaptive FET Non−overlap Time of Internal Gate Driver

• 5.0 V to 12 V Operation

• Support 1.5 V to 19 V Vin

• Vout from 0.8 V to 3.3 V (5 V with 12 VCC)

• Chip Enable through OSC pin

• Latched Over Voltage Protection (OVP)

• Internally Fixed OCP Threshold

• Guaranteed Startup Into Pre−Charged Loads

• Thermally Compensated Current Monitoring

• Thermal Shutdown Protection

• Integrated MOSFET Drivers

• Integrated BOOST Diode with internal Rbst = 2.2 W

• Automatic Power Saving Mode to Maximize Efficiency During Light

Load Operation

• Sync Function

• Remote Ground Sensing

• This is a Pb−Free Device*

Applications

• Desktop and Server Systems

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

http://onsemi.com

QFN16

CASE 485G

MARKING

DIAGRAMS

4

1

16

13

9

12

58

14

7

15

6

310

211

FB

VSEN

FBG

CSN/VO

BOOT

LX

LG

VCCP

PIN CONNECTIONS

1

5230

ALYWG

G

5230

= Specific Device Code

A

= Assembly Location

L

= Wafer Lot

Y

= Year

W

= Work Week

G

= Pb−Free Package

(*Note: Microdot may be in either location)

Device

Package

Shipping

ORDERING INFORMATION

NCP5230MNTWG

QFN16

(Pb−Free)

3000 / Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

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