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ADA4666-2 Datasheet(PDF) 9 Page - Analog Devices |
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ADA4666-2 Datasheet(HTML) 9 Page - Analog Devices |
9 / 32 page ![]() Data Sheet ADA4666-2 Rev. 0 | Page 9 of 32 ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Rating Supply Voltage 20.5 V Input Voltage (V−) − 300 mV to (V+) + 300 mV Input Current1 ±10 mA Differential Input Voltage Limited by maximum input current Output Short-Circuit Duration to GND Refer to the Maximum Power Dissipation section Temperature Range Storage −65°C to +150°C Operating −40°C to +125°C Junction −65°C to +150°C Lead Temperature (Soldering, 60 sec) 300°C ESD 4 kV Human Body Model2 Machine Model3 400 V Field-Induced Charged- Device Model (FICDM)4 1.25 kV 1 The input pins have clamp diodes to the power supply pins and to each other. Limit the input current to 10 mA or less when input signals exceed the power supply rail by 0.3 V. 2 Applicable standard: MIL-STD-883, Method 3015.7. 3 Applicable standard: JESD22-A115-A (ESD machine model standard of JEDEC). 4 Applicable Standard JESD22-C101C (ESD FICDM standard of JEDEC). Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages using a standard 4-layer JEDEC board. The exposed pad of the LFCSP package is soldered to the board. Table 6. Thermal Resistance Package Type θJA θJC Unit 8-Lead MSOP 142 45 °C/W 8-Lead LFCSP 83.5 48.51 °C/W 1 θJC is measured on the top surface of the package. ESD CAUTION |
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