Data Sheet

AD536A

Rev. E | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage

Dual Supply

±18 V

Single Supply

+36 V

Internal Power Dissipation

500 mW

Maximum Input Voltage

±25 V peak

Buffer Maximum Input Voltage

±V

S

Maximum Input Voltage

±25 V peak

Storage Temperature Range

−55°C to +150°C

Operating Temperature Range

AD536AJ/AD536AK

0°C to +70°C

AD536AS

−55°C to +125°C

Lead Temperature (Soldering, 60 sec)

300°C

ESD Rating

1000 V

Thermal Resistance θ

JA

1

10-Pin Header (H-10 Package)

150°C/W

20-Terminal LCC (E-20 Package)

95°C/W

14-Lead SBDIP (D-14 Package)

95°C/W

14-Lead CERDIP (Q-14 Package)

95°C/W

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

circuit board for surface-mount packages.

PAD NUMBERS CORRESPOND TO PIN NUMBERS FOR THE

TO-100 14-LEAD CERAMIC DIP PACKAGE.

THE AD536A IS AVAILABLE IN LASER-TRIMMED CHIP FORM.

14

COM

10

8

BUF IN

7

BUF OUT

6

dB

5

4

3

9

0.1315 (3.340)

0.0807

(2.050)

Figure 2. Die Dimensions and Pad Layout

Dimensions shown in inches and (millimeters)