S1C17555/565/955/965

12-bit A/D converter (aDC12Sa)

Conversion method

–

Successive

approximation type

–

Successive

approximation type

Analog input channel

–

6 channels

(Three channels can

only be used for

multichannel

conversion.)

–

6 channels

(Three channels can

only be used for

multichannel

conversion.)

Resolution

–

12 bits

–

12 bits

Interrupts

Reset interrupt

#RESET pin

NMI

Watchdog timer

Programmable interrupts

21 systems (8 levels)

22 systems (8 levels)

21 systems (8 levels)

22 systems (8 levels)

Power supply voltage

1.65 V to 1.95 V

1.65 V to 1.95 V

(Not required when the

regulator is used)

1.65 V to 1.95 V

1.65 V to 1.95 V

(Not required when the

regulator is used)

1.65 V to 3.6 V

2.0 V to 3.6 V

(When the regulator is

used)

1.65 V to 3.6 V

(When the regulator is

not used)

1.65 V to 3.6 V

2.0 V to 3.6 V

(When the regulator is

used)

1.65 V to 3.6 V

(When the regulator is

not used)

–

2.7 V to 3.6 V (Not

required when the

regulator is used)

–

2.7 V to 3.6 V (Not

required when the

regulator is used)

Flash programming voltage

7.5 V (Not required when the regulator/booster is used.)

Regulators

–

Input: 2.0 V to 3.6 V

Output: 1.8 V

–

Input: 2.0 V to 3.6 V

Output: 1.8 V

–

Input: 3.1 V to 3.6 V,

Output: 2.8 V

–

Input: 3.1 V to 3.6 V,

Output: 2.8 V

Input: 2.4 V to 3.6 V

Output: 7.5 V

Operating temperature

Operating temperature range

-40°C to 85°C (10 to 40°C when programing/erasing the Flash)

Current consumption (Typ. value, lVDD = hVDD = 1.8 V, regulator not used)

SLEEP state

1.0

μA (IOSC = Off, OSC1 = Off, OSC3 = Off)

HALT state

2.9

μA (IOSC = Off, OSC1 = 32 kHz, OSC3 = Off)

Run state

3500

μA (IOSC = 12 MHz, OSC1 = Off, OSC3 = Off)

FSA operating current

-

+270

μA/MHz

Shipping form

1

WCSP-48

3.863 × 3.863 × 0.8 mm,

ball pitch: 0.5 mm

TQFP13-64pin

10 × 10 × 1.0 mm,

lead pitch: 0.5 mm

WCSP-48

3.863 × 3.863 × 0.8 mm,

ball pitch: 0.5 mm

TQFP13-64pin

10 × 10 × 1.0 mm,

lead pitch: 0.5 mm

2

Die form

3.863 × 3.863 mm,

pad pitch: 140

μm

Die form

3.863 × 3.863 mm,

pad pitch: 140

μm

*1 For more information on the FSA, please contact Seiko Epson.

2

Seiko Epson Corporation