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EP3C55F780I7 Datasheet(PDF) 4 Page - Altera Corporation |
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EP3C55F780I7 Datasheet(HTML) 4 Page - Altera Corporation |
4 / 8 page Cyclone III FPGAs • March 2007 • www.altera.com Features and benefits You can turn ideas into revenue faster than ever because we deliver numerous features and benefits that help you lower your system and development costs. Flexibility enables you to keep up with fast-evolving standards easily. Scalable digital signal processing (DSP) perfor- mance and embedded memory let you increase or enhance feature sets. All of this with the lowest power consumption of any FPGA available today. To top it off, we’re the lowest-cost FPGA solution around. Choose Altera to win. • Manufactured using a low-power 65-nm process technology. • Core static power as low as 35 mW at 25oC junction temperature. • Support for hot-socketing operation so unused I/O banks can be turned off when there’s no current. • Low-power benefits include: system thermal management, elimination or reduction in cooling system costs, and extended battery life for portable applications. • Staggered I/O ring to reduce die size and board space. • Selection of low-cost packages. • Support for low-cost serial flash and commodity parallel flash configu- ration devices. • Cyclone series FPGAs are built from the ground up for low cost. • 1.7 times the density to 120,000 logic elements (LEs) and over 3.5 times the embedded memory to 4 Mbits over Cyclone II FPGAs. • 260-MHz multiplier performance with the highest multiplier-to-logic ratio in the industry. • Robust clock management and synthesis with dynamically reconfigu- rable and flexible phase-locked loops (PLLs). • Improved signal integrity with adjustable I/O slew rates. • Support for high-speed external memory interfaces including DDR, DDR2, SDR SDRAM, and QDRII SRAM with an autocalibrating PHY for fast timing closure. • Support for I/O standards including LVTTL, LVCMOS, SSTL, High- Speed Transceiver Logic (HSTL), PCI Express, LVPECL, LVDS, mini- LVDS, reduced swing differential signaling (RSDS), and point-to-point differential signaling (PPDS). Lowest-power 65-nm FPGAs Cyclone III floorplan Cyclone III floorplan M9K memory blocks Embedded 18-bit x 18-bit multipliers Top and bottom I/O cells for memory interfaces up to 400 Mbps Logic array Side I/O cells with support for LVDS signals up to 875 Mbps Phase-locked loops Cost optimized for the best value anywhere Complete system integration |
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