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AD5662ARJ-1500RL7 Datasheet(PDF) 20 Page - Analog Devices |
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AD5662ARJ-1500RL7 Datasheet(HTML) 20 Page - Analog Devices |
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20 / 24 page  AD5662 Rev. A | Page 20 of 24 USING AD5662 WITH A GALVANICALLY ISOLATED INTERFACE In process-control applications in industrial environments, it is often necessary to use a galvanically isolated interface to protect and isolate the controlling circuitry from any hazardous common-mode voltages that might occur in the area where the DAC is functioning. Isocouplers provide isolation in excess of 3 kV. The AD5662 uses a 3-wire serial logic interface, so the ADuM130x 3-channel digital isolator provides the required isolation (see Figure 44). The power supply to the part also needs to be isolated, which is done by using a transformer. On the DAC side of the transformer, a 5 V regulator provides the 5 V supply required for the AD5662. 0.1 μF +5V REGULATOR GND DIN SYNC SCLK POWER 10 μF SDI SCLK DATA AD5662 VOUT VOB VOC VDD V1C V1B V1A ADMu103x Figure 44. AD5662 with a Galvanically Isolated Interface POWER SUPPLY BYPASSING AND GROUNDING When accuracy is important in a circuit, it is helpful to carefully consider the power supply and ground return layout on the board. The printed circuit board containing the AD5662 should have separate analog and digital sections, each having its own area of the board. If the AD5662 is in a system where other devices require an AGND-to-DGND connection, the connection should be made at one point only. This ground point should be as close as possible to the AD5662. The power supply to the AD5662 should be bypassed with 10 μF and 0.1 μF capacitors. The capacitors should be located as close as possible to the device, with the 0.1 μF capacitor ideally right up against the device. The 10 μF capacitors are the tantalum bead type. It is important that the 0.1 μF capacitor has low effective series resistance (ESR) and effective series inductance (ESI), for example, common ceramic types of capacitors. This 0.1 μF capacitor provides a low impedance path to ground for high frequencies caused by transient currents due to internal logic switching. The power supply line itself should have as large a trace as possible to provide a low impedance path and to reduce glitch effects on the supply line. Clocks and other fast switching digital signals should be shielded from other parts of the board by digital ground. Avoid crossover of digital and analog signals if possible. When traces cross on opposite sides of the board, ensure that they run at right angles to each other to reduce feedthrough effects through the board. The best board layout technique is the microstrip technique where the component side of the board is dedicated to the ground plane only and the signal traces are placed on the solder side. However, this is not always possible with a 2-layer board. |
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