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FDC37C78-HT Datasheet(PDF) 80 Page - Microchip Technology |
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FDC37C78-HT Datasheet(HTML) 80 Page - Microchip Technology |
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80 / 82 page  80 FIGURE 8 – 48 PIN TQFP PACKAGE DIMENSIONS MIN NOMINAL MAX REMARK A ~ ~ 1.6 Overall Package Height A1 0.05 0.10 0.15 Standoff A2 1.35 1.40 1.45 Body Thickness D 8.80 9.00 9.20 X Span D/2 4.40 4.50 4.60 1/ 2 X Span Measure from Centerline D1 6.90 7.00 7.10 X body Size E 8.80 9.00 9.10 Y Span E/2 4.40 4.50 4.60 1/ 2 Y Span Measure from Centerline E1 6.90 7.00 7.10 Y body Size H 0.09 ~ 0.20 Lead Frame Thickness L 0.45 0.60 0.75 Lead Foot Length from Centerline L1 ~ 1.00 ~ Lead Length e 0.50 Basic Lead Pitch θ 0 o ~ 7 o Lead Foot Angle W 0.17 ~ 0.27 Lead Width R1 0.08 ~ ~ Lead Shoulder Radius R2 0.08 ~ 0.20 Lead Foot Radius |
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