• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

C31E.pdf

Mar.28,2011

93

oFlow Soldering profile

( Sn-3.0Ag-0.5Cu Solder)

BLM (Except BLM02/03/15/18G)

BLA31

Series

Pre-heating

Standard Profile

Limit Profile

Heating

Temp. (T1)

Temp. (T2)

Time. (t1)

150

°C

60s min.

250

°C

4 to 6s

2 times

max.

5s max.

2 times

max.

265

±3°C

Time. (t2)

Heating

Cycle

of Flow

Temp. (T3)

Time. (t2)

Cycle

of Flow

T1

T3

T2

Pre-heating

Time (s)

t2

Heating

Limit Profile

Standard Profile

t1

(2) Soldering Profile

oReflow Soldering Profile

(Sn-3.0Ag-0.5Cu Solder)

BLM

BLA

Series

Standard Profile

Limit Profile

Temp. (T1)

Time. (t1)

Heating

220

°C min. 30 to 60s

245

±3°C

2 times

max.

230

°C min.

260

°C/10s

2 times

max.

60s max.

Cycle

of Reflow

Peak

Temperature

(T2)

Temp. (T3)

Time. (t2)

Heating

Cycle

of Reflow

Peak

Temperature

(T4)

150

180

T2

T4

T3

T1

90s

±30s

Time (s)

t2

t1

Limit Profile

Standard Profile

Pre-heating

BLp Chip Ferrite Bead

Soldering and Mounting

3. Standard Soldering Conditions

(1) Soldering Methods

Use flow and reflow soldering methods only.

Use standard soldering conditions when soldering chip

ferrite beads.

In cases where several different parts are soldered, each

having different soldering conditions, use those

conditions requiring the least heat and minimum time.

Solder: Use Sn-3.0Ag-0.5Cu solder. Use of Sn-Zn based

solder will deteriorate performance of products.

If using BLA series with Sn-Zn based solder,

please contact Murata in advance.

Flux:

o Use Rosin-based flux.

In case of using RA type solder, products should be

cleaned completely with no residual flux.

o Do not use strong acidic flux (with chlorine content

exceeding 0.20wt%)

o Do not use water-soluble flux.

For additional mounting methods, please contact Murata.