• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

C31E.pdf

Mar.28,2011

92

2. Solder Paste Printing and Adhesive Application

When reflow soldering the chip ferrite beads, the printing

must be conducted in accordance with the following

cream solder printing conditions.

If too much solder is applied, the chip will be prone to

damage by mechanical and thermal stress from the PCB

and may crack.

Standard land dimensions should be used for resist and

copper foil patterns.

When flow soldering the chip ferrite beads, apply the

adhesive in accordance with the following conditions.

If too much adhesive is applied, then it may overflow into

the land or termination areas and yield poor solderability.

In contrast, if insufficient adhesive is applied, or if the

adhesive is not sufficiently hardened, then the chip may

become detached during flow soldering process.

BLM

BLM18/21/31/41 Series

(Except BLM18G Series)

Coating amount is illustrated in the

following diagram.

(in mm)

oEnsure that solder is applied smoothly to a

minimum height of 0.2mm to 0.3mm at the end

surface of the part.

oGuideline of solder paste thickness:

50-80

µm: BLM02

100-150

µm: BLM03

100-200

µm: BLM15/18/21/31/41

a: 20

−70µm

b: 30

−35µm

c: 50

−105µm

c

a

b

Chip Solid Inductor

Bonding agent

Land

PCB

BLA

BLA31 Series

Coating amount is illustrated in the

following diagram.

oGuideline of solder paste thickness:

100-150

µm: BLA2A

150-200

µm: BLA31

a: 20

−70µm

b: 30

−35µm

c: 50

−105µm

c

a

b

Chip Solid Inductor

Bonding Agent

Land

PCB

Series

Solder Paste Printing

Adhesive Application

(Except BLM

15_AN1 series)

0.4

1.75

0.8

0.25

0.25

BLA31

BLA2A

BLp Chip Ferrite Bead

Soldering and Mounting

PCB should be designed so that products are not

subjected to the mechanical stress caused by warping

the board.

Poor example

Products should be located in the sideways direction

(Length: a<b) to the mechanical stress.

Good example

a

b