• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

C31E.pdf

Mar.28,2011

90

Chip Ferrite Bead

!Caution/Notice

1. About the Rated Current

Do not use products beyond the rated current as this

may create excessive heat and deteriorate the

insulation resistance.

2. About the Excessive Surge Current

Excessive surge current ( pulse current or rush

current) than specified rated current applied to the

product may cause a critical failure, such as an open

circuit, burnout caused by excessive temperature

rise. Please contact us in advance in case of

applying the surge current.

q Soldering and Mounting

• Self-heating

Please provide special attention when mounting chip

ferrite beads BLM_AX/P/K/S series in close proximity

to other products that radiate heat.

The heat generated by other products may deteriorate

the insulation resistance and cause excessive heat in

this component.

q Rating

q Storage and Operating Conditions

q Notice (Soldering and Mounting)

<Operating Environment>

Do not use products in a chemical atmosphere such as

chlorine gas, acid or sulfide gas.

Do not use products in the environment close to the

organic solvent.

<Storage and Handling Requirements>

1. Storage Period

BLM15E/15H/15G series should be used within 12

months, the other series should be used within 6

months.

Solderability should be checked if this period is

exceeded.

2. Storage Conditions

(1) Storage temperature: -10 to +40˚C

Relative humidity: 15 to 85%

Avoid sudden changes in temperature and humidity.

(2) Do not store products in a chemical atmosphere

such as chlorine gas, acid or sulfide gas.

1. Cleaning

Failure and degradation of a product are caused

by the cleaning method. When you clean in conditions

that are not in mounting information, please contact

Murata engineering.

2. Soldering

Reliability decreases with improper soldering methods.

Please solder by the standard soldering conditions

shown in mounting information.

3. Other

Noise suppression levels resulting from Murata's EMI

suppression filters EMIFILr may vary, depending on

the circuits and ICs used, type of noise, mounting

pattern, mounting location, and other operating

conditions. Be sure to check and confirm in advance

the noise suppression effect of each filter, in actual

circuits, etc. before applying the filter in a commercial-

purpose equipment design.

q Handling

1. Resin Coating

Using resin for coating/molding products may affect

the products performance.

So please pay careful attention in selecting resin.

Prior to use, please make the reliability evaluation with

the product mounted in your application set.

!Caution

Notice

2. Handling of a Substrate

After mounting products on a substrate, do not apply

any stress to the product caused by bending or

twisting to the substrate when cropping the substrate,

inserting and removing a connector from the substrate

or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in

the Product.

Bending

Twisting