13

AT24C128/256

0670T–SEEPR–3/07

Notes:

1. This device is not recommended for new design. Please refer to AT24C128B datasheet. For 2.7V devices used in the 4.5V to

5.5V range, please refer to performance values in the AC and DC characteristics tables.

2. “U” designates Green package + RoHS compliant.

3. Available in waffle pack and wafer form; order as SL788 for wafer form. Bumped die available upon request. Please contact

Serial EEPROM Marketing.

Ordering Code

Package

Operation Range

8P3

8P3

8S1

8S1

8S2

8S2

8A2

8A2

8U2-1

8Y1

8Y4

Lead-free/Halogen-free/

Industrial Temperature

(–40

° C to 85° C)

Die Sale

Industrial Temperature

(–40

° C to 85° C)

Package Type

8P3

8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8S1

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)

8S2

8-lead, 0.200" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)

8U2-1

8-ball, die Ball Grid Array Package (dBGA2)

8Y1

8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)

8Y4

8-lead, 6.00 mm x 4.90 mm Body, Dual Footprint, Non-leaded, Small Array Package (SAP)

8A2

8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)

Options

–2.7

Low-voltage (2.7V to 5.5V)

–1.8

Low-voltage (1.8V to 3.6V)