Si8440/41/42/45

28

Rev. 1.5

Revision C Devices2

Si8440AA-C-IS1

4

0

1

1 kVrms

–40 to 125 °C

NB SOIC-161

Si8440BA-C-IS1

4

0

150

Si8441AA-C-IS1

3

1

1

Si8441BA-C-IS1

3

1

150

Si8442AA-C-IS1

2

2

1

Si8442BA-C-IS1

2

2

150

Si8445BA-C-IS1

4

0

150

Si8440AB-C-IS

4

0

1

2.5 kVrms

–40 to 125 °C

WB SOIC-161

Si8440BB-C-IS

4

0

150

Si8441AB-C-IS

3

1

1

Si8441BB-C-IS

3

1

150

Si8442AB-C-IS

2

2

1

Si8442BB-C-IS

2

2

150

Si8445BB-C-IS

4

0

150

Si8440AB-C-IS1

4

0

1

2.5 kVrms

–40 to 125 °C

NB SOIC-161

Si8440BB-C-IS1

4

0

150

Si8441AB-C-IS1

3

1

1

Si8441BB-C-IS1

3

1

150

Si8442AB-C-IS1

2

2

1

Si8442BB-C-IS1

2

2

150

Si8445BB-C-IS1

4

0

150

Ordering Part

Number (OPN)

Number of

Inputs VDD1

Side

Number of

Inputs VDD2

Side

Maximum

Data Rate

(Mbps)

Isolation

Rating

Temp Range

Package Type

Notes:

1. All packages are RoHS-compliant with peak reflow temperatures of 260 °C according to the JEDEC industry standard

classifications and peak solder temperatures.

Moisture sensitivity level is MSL2A for wide-body SOIC-16 packages.

Moisture sensitivity level is MSL2A for narrow-body SOIC-16 packages.

2. Revision C devices are supported for existing designs, but Revision D is recommended for all new designs.

3. AEC-Q100 qualified.