VIN

CTRL

SW

FB

COMP

GND

TOP VIEW

Thermal

Pad

6-PIN2mmx2mmx0.8mmQFN

TPS61160

TPS61161

SLVS791C – NOVEMBER 2007 – REVISED APRIL 2012

www.ti.com

ELECTRICAL CHARACTERISTICS (continued)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

EasyScale TIMING

Start time of program stream

2

μs

End time of program stream

2

360

μs

High time low bit

Logic 0

2

180

μs

Low time low bit

Logic 0

360

μs

High time high bit

Logic 1

360

μs

Low time high bit

Logic 1

2

180

μs

Acknowledge output voltage low

0.4

V

Acknowledge valid time

2

μs

Duration of acknowledge condition

512

μs

THERMAL SHUTDOWN

Thermal shutdown threshold

160

°C

Thermal shutdown threshold hysteresis

15

°C

(2)

Acknowledge condition active 0, this condition will only be applied in case the RFA bit is set. Open drain output, line needs to be pulled

high by the host with resistor load.

DEVICE INFORMATION

TERMINAL FUNCTIONS

TERMINAL

I/O

DESCRIPTION

NAME

NO.

VIN

6

I

The input supply pin for the IC. Connect VIN to a supply voltage between 2.7V and 18V.

This is the switching node of the IC. Connect the inductor between the VIN and SW pin. This pin is also

SW

4

I

used to sense the output voltage for open LED protection

GND

3

O

Ground

FB

1

I

Feedback pin for current. Connect the sense resistor from FB to GND.

Output of the transconductance error amplifier. Connect an external capacitor to this pin to compensate the

COMP

2

O

converter.

Control pin of the boost converter. It is a multi-functional pin which can be used for enable control, PWM

CTRL

5

I

and digital dimming.

The thermal pad should be soldered to the analog ground plane. If possible, use thermal via to connect to

Thermal Pad

ground plane for ideal power dissipation.

4

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