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TMP451 Datasheet(PDF) 22 Page - Texas Instruments |
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TMP451 Datasheet(HTML) 22 Page - Texas Instruments |
22 / 27 page ![]() V+ D+ D- GND Ground or V+ layer on bottom and/or top, if possible. TMP451 SBOS686 – JUNE 2013 www.ti.com temperature that the TMP451 is measuring. Additionally, the internal power dissipation of the TMP451 can cause the temperature to rise above the ambient or PCB temperature. The internal power dissipated as a result of exciting the remote temperature sensor is negligible because of the small currents used. For a 3.3-V supply and maximum conversion rate of 16 conversions per second, the TMP451 dissipate 0.54 mW (PDIQ = 3.3 V × 165 μA). A θJA of 171.3°C/W causes the junction temperature to rise approximately +0.09°C above the ambient. LAYOUT CONSIDERATIONS Remote temperature sensing on the TMP451 measures very small voltages using very low currents; therefore, noise at the device inputs must be minimized. Most applications using the TMP451 have high digital content, with several clocks and logic level transitions creating a noisy environment. Layout should adhere to the following guidelines: 1. Place the TMP451 as close to the remote junction sensor as possible. 2. Route the D+ and D– traces next to each other and shield them from adjacent signals through the use of ground guard traces; see Figure 19. If a multilayer PCB is used, bury these traces between ground or V+ planes to shield them from extrinsic noise sources. 5 mil (0.127 mm) PCB traces are recommended. 3. Minimize additional thermocouple junctions caused by copper-to-solder connections. If these junctions are used, make the same number and approximate locations of copper-to-solder connections in both the D+ and D– connections to cancel any thermocouple effects. 4. Use a 0.1 μF local bypass capacitor directly between the V+ and GND of the TMP451. For optimum measurement performance, minimize filter capacitance between D+ and D– to 1000 pF or less . This capacitance includes any cable capacitance between the remote temperature sensor and the TMP451. 5. If the connection between the remote temperature sensor and the TMP451 is less than 8 in (20.32 cm) long, use a twisted-wire pair connection. For lengths greater than 8 in, use a twisted, shielded pair with the shield grounded as close to the TMP451 as possible. Leave the remote sensor connection end of the shield wire open to avoid ground loops and 60-Hz pickup. 6. Thoroughly clean and remove all flux residue in and around the pins of the TMP451 to avoid temperature offset readings as a result of leakage paths between D+ and GND, or between D+ and V+. NOTE: Use minimum 5 mil (0.127 mm) traces with 5 mil spacing. Figure 19. Suggested PCB Layer Cross-Section 22 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TMP451 |
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