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TMP451 Datasheet(PDF) 2 Page - Texas Instruments |
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TMP451 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 27 page ![]() TMP451 SBOS686 – JUNE 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE AND ORDERING INFORMATION(1) TWO-WIRE PRODUCT DESCRIPTION ADDRESS Single Channel TMP451 Remote Junction 1001 100 Temperature Sensor (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. VALUE UNIT Power supply, V+ –0.3 to +3.6 V Pins 4, 6, 7, and 8 only –0.3 to +3.6 V Input voltage Pin 2 only –0.3 to (V+) + 0.3 V Pin 3 only –0.3 to +0.3 V Input current 10 mA Operating temperature range –55 to +127 °C Storage temperature range –60 to +150 °C Junction temperature (TJ max) +150 °C Human body model (HBM) 3000 V Electrostatic discharge (ESD) Charged device model (CDM) 1000 V ratings Machine model (MM) 200 V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. THERMAL INFORMATION TMP451 THERMAL METRIC(1) DQF (DFN) UNITS 8 PINS θJA Junction-to-ambient thermal resistance 171.3 θJCtop Junction-to-case (top) thermal resistance 81.4 θJB Junction-to-board thermal resistance 137.9 °C/W ψJT Junction-to-top characterization parameter 3.9 ψJB Junction-to-board characterization parameter 140 θJCbot Junction-to-case (bottom) thermal resistance N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TMP451 |
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