OPA317

OPA2317

OPA4317

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SBOS682A – MAY 2013 – REVISED JUNE 2013

THERMAL INFORMATION: OPA317

OPA317

D (SOIC)

DBV (SOT23)

DCK (SC70)

UNITS

8 PINS

5 PINS

5 PINS

Junction-to-ambient thermal resistance

140.1

220.8

298.4

Junction-to-case (top) thermal resistance

89.8

97.5

65.4

Junction-to-board thermal resistance

80.6

61.7

97.1

°C/W

Junction-to-top characterization parameter

28.7

7.6

0.8

Junction-to-board characterization parameter

80.1

61.1

95.5

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

THERMAL INFORMATION: OPA2317

OPA2317

D (SOIC)

DGK (MSOP)

UNITS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

124.0

180.3

Junction-to-case (top) thermal resistance

73.7

48.1

Junction-to-board thermal resistance

64.4

100.9

°C/W

Junction-to-top characterization parameter

18.0

2.4

Junction-to-board characterization parameter

63.9

99.3

Junction-to-case (bottom) thermal resistance

N/A

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

THERMAL INFORMATION: OPA4317

OPA4317

D (SOIC)

PW (TSSOP)

UNITS

14 PINS

14 PINS

Junction-to-ambient thermal resistance

83.8

120.8

Junction-to-case (top) thermal resistance

70.7

34.3

Junction-to-board thermal resistance

59.5

62.8

°C/W

Junction-to-top characterization parameter

11.6

1.0

Junction-to-board characterization parameter

37.7

56.5

Junction-to-case (bottom) thermal resistance

N/A

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Copyright © 2013, Texas Instruments Incorporated

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Product Folder Links: OPA317 OPA2317 OPA4317