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CL10B101KB8NNNC Datasheet(PDF) 31 Page - Samsung semiconductor |
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CL10B101KB8NNNC Datasheet(HTML) 31 Page - Samsung semiconductor |
31 / 35 page Multilayer Ceramic Capacitor - General - 30 - ▶ Amount of Solder Too much Solder Not enough Solder Cracks tend to occur due to large stress Weak holding force may cause bad connections or detaching of the capacitor Good ▶ Cooling Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning, the temperature difference(△T) must be less than 100℃ 6-6. Cleaning If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used, chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the chip capacitors. This means that the cleaning fluid must be carefully selected, and should always be new. ▶ Notes for Separating Multiple, Shared PC Boards. A multi-PC board is separated into many individual circuit boards after soldering has been completed. If the board is bent or distorted at the time of separation, cracks may occur in the chip capacitors. Carefully choose a separation method that minimizes the bending of the circuit board. |
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