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CL10B101KB8NNNC Datasheet(PDF) 29 Page - Samsung semiconductor

Part # CL10B101KB8NNNC
Description  Multilayer Ceramic Capacitor
Download  35 Pages
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

CL10B101KB8NNNC Datasheet(HTML) 29 Page - Samsung semiconductor

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Multilayer Ceramic Capacitor - General
- 28 -
They should be a good insulator.
They should be non-toxic, and not produce harmful gases, nor be harmful when touched.
▶ Application Method
It is important to use the proper amount of adhesive. Too little and much adhesive will cause
poor adhesion and overflow into the land, respectively.
▶ Adhesive hardening Characteristics
To prevent oxidation of the terminations, the adhesive must harden at 160℃ or less, within
2 minutes or less.
● Mounting
▶ Mounting Head Pressure
Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum
during mounting.
▶ Bending Stress
When double-sided circuit boards are used, MLCCs first are mounted and soldered onto one side
of the board. When the MLCCs are mounted onto the other side, it is important to support the
board as shown in the illustration.
If the circuit board is not supported, the crack occur to the
ready-installed MLCCs by the bending stress.
support pin
force
nozzle
● Flux
Although the solderability increased by the highly-activated flux, increase of activity in flux may
also degrade the insulation of the chip capacitors. To avoid such degradation, it is recommended
that a mildly activated rosin flux(less than 0.2% chlorine) be used.


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