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CL10B101KB8NNNC Datasheet(PDF) 28 Page - Samsung semiconductor |
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CL10B101KB8NNNC Datasheet(HTML) 28 Page - Samsung semiconductor |
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28 / 35 page  Multilayer Ceramic Capacitor - General - 27 - ■ APPLICATION MANUAL ● Storage Condition ▶ Storage Environment The electrical characteristics of MLCCs were degraded by the environment of high temperature or humidity. Therefore, the MLCCs shall be stored in the ambient temperature and the relative humidity of less than 40℃ and 70%, respectively. Guaranteed storage period is within 6 months from the outgoing date of delivery. ▶ Corrosive Gases Since the solderability of the end termination in MLCC was degraded by a chemical atmosphere such as chlorine, acid or sulfide gases, MLCCs must be avoid from these gases. ▶ Temperature Fluctuations Since dew condensation may occur by the differences in temperature when the MLCCs are taken out of storage, it is important to maintain the temperature-controlled environment. ● Design of Land Pattern When designing printed circuit boards, the shape and size of the lands must allow for the proper amount of solder on the capacitor. The amount of solder at the end terminations has a direct effect on the crack. The crack in MLCC will be easily occurred by the tensile stress which was due to too much amount of solder. In contrast, if too little solder is applied, the termination strength will be insufficiently. Use the following illustrations as guidelines for proper land design. Recommendation of Land Shape and Size W b a Solder Land Solder Resist 2/3W < b < W T Solder Resist 2/3T < a < T ● Adhesives When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions. ▶ Requirements for Adhesives They must have enough adhesion, so that, the chips will not fall off or move during the handling of the circuit board. They must maintain their adhesive strength when exposed to soldering temperature. They should not spread or run when applied to the circuit board. They should harden quickly. They should not corrode the circuit board or chip material. |
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