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AD5320 Datasheet(PDF) 16 Page - Analog Devices |
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AD5320 Datasheet(HTML) 16 Page - Analog Devices |
16 / 20 page AD5320 Rev. C | Page 16 of 20 POWER SUPPLY BYPASSING AND GROUNDING When accuracy is important in a circuit, it is helpful to consider carefully the power supply and ground return layout on the board. The printed circuit board containing the AD5320 should have separate analog and digital sections, each having its own area of the board. If the AD5320 is in a system where other devices require an AGND to DGND connection, the connec- tion should be made at one point only. This ground point should be as close as possible to the AD5320. The power supply to the AD5320 should be bypassed with 10 μF capacitors and 0.1 μF capacitors. The capacitors should be physi- cally as close as possible to the device with the 0.1 μF capacitors ideally against the device. The 10 μF capacitors are the tantalum bead type. It is important that the 0.1 μF capacitors have low effective series resistance (ESR) and effective series inductance (ESI), such as common ceramic types of capacitors. The 0.1 μF capacitors provide a low impedance path to ground for high frequencies caused by transient currents due to internal logic switching. The power supply line itself should have as large a trace as possible to provide a low impedance path and reduce glitch effects on the supply line. Clocks and other fast switching digital signals should be shielded from other parts of the board by digital ground. Avoid crossover of digital and analog signals if possible. When traces cross on opposite sides of the board, ensure that they run at right angles to each other to reduce feedthrough effects through the board. The best board layout technique is the microstrip technique where the component side of the board is dedicated to the ground plane only and the signal traces are placed on the solder side. However, this is not always possible with a two-layer board. |
Similar Part No. - AD5320_05 |
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Similar Description - AD5320_05 |
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