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FTR-K1 SERIES

1. General Information

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All signal and power relays produced by Fujitsu Components are compliant with RoHS directive 2002/95EC

including amendments.

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Cadmium as used in electrical contacts is exempted from the RoHS directives on October 21st, 2005.

(Amendment to Directive 2002/95/EC)

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All of our signal and power relays are lead-free. Please refer to Lead-Free Status Info for older date codes

at: http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf

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Lead free solder plating on relay terminals is Sn-3.0Ag-0.5Cu, unless otherwise specified.

This material has been verified to be compatible with PbSn assembly process.

2. Recommended Lead Free Solder Profile

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Recommended solder Sn-3.0Ag-0.5Cu.

RoHS Compliance and Lead Free Information

3. Moisture Sensitivity

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Moisture Sensitivity Level standard is not applicable to electromechanical relays, unless otherwise indicated.

4. Tin Whiskers

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Dipped SnAgCu solder is known as presenting a low risk to tin whisker development. No considerable length

whisker was found by our in house test.

We highly recommend that you confirm your actual solder conditions

Flow Solder condition:

Pre-heating:

maximum 120˚C

Soldering:

dip within 5 sec. at

260˚C solder bath

Solder by Soldering Iron:

Soldering Iron

Temperature: maximum 360˚C

Duration:

maximum 3 sec.

NA SERIES