INA138, INA168

2

SBOS122C

www.ti.com

Supply Voltage, V+

INA138 ............................................................................... –0.3V to 60V

INA168 ............................................................................... –0.3V to 75V

INA138

INA168

Input Current Into Any Pin ............................................................... 10mA

Operating Temperature .................................................. –55

°C to +150°C

Storage Temperature ..................................................... –65

°C to +150°C

Junction Temperature .................................................................... +150

°C

NOTE: (1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods may degrade

device reliability. These are stress ratings only, and functional operation of the

device at these or any other conditions beyond those specified is not implied.

(2) The input voltage at any pin may exceed the voltage shown if the current

at that pin is limited to 10mA.

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

DESIGNATOR

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

INA138

SOT23-5 Surface-Mount

DBV

–40

°C to +125°C

B38

INA138NA/250

Tape and Reel, 250

""

"

"

"

INA138NA/3K

Tape and Reel, 3000

INA168

SOT23-5 Surface-Mount

DBV

–40

°C to +125°C

A68

INA168NA/250

Tape and Reel, 250

""

"

"

"

INA168NA/3K

Tape and Reel, 3000

NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at

www.ti.com.

PIN CONFIGURATION

Top View

SOT23

OUT

GND

V

IN+

V+

V

IN–

1

2

3

5

4

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degrada-

tion to complete device failure. Precision integrated circuits

may be more susceptible to damage because very small

parametric changes could cause the device not to meet its

published specifications.