REV. E

AD630

–3–

THERMAL CHARACTERISTICS

JC

JA

20-Lead PDIP (N)

24

°C/W

61

°C/W

20-Lead Ceramic DIP (D)

35

°C/W

120

°C/W

20-Lead Leadless Chip Carrier LCC (E)

35

°C/W

120

°C/W

20-Lead SOIC (R-20)

38

°C/W

75

°C/W

ABSOLUTE MAXIMUM RATINGS

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±18 V

Internal Power Dissipation . . . . . . . . . . . . . . . . . . . . 600 mW

Output Short-Circuit to Ground . . . . . . . . . . . . . . . Indefinite

Storage Temperature, Ceramic Package . . . –65

°C to +150°C

Storage Temperature, Plastic Package . . . . . –55

°C to +125°C

Lead Temperature Range (Soldering, 10 sec) . . . . . . . . 300

°C

Maximum Junction Temperature . . . . . . . . . . . . . . . . . 150

°C

PIN CONFIGURATIONS

20-Lead SOIC, PDIP, and CERDIP

14

13

12

11

17

16

15

20

19

18

10

9

8

1

2

3

4

7

6

5

TOP VIEW

(Not to Scale)

AD630

CH B+

CH B–

CH A–

CH A+

DIFF OFF ADJ

DIFF OFF ADJ

CM OFF ADJ

CM OFF ADJ

SEL B

SEL A

COMP

CHANNEL STATUS B/

A

20-Terminal CLCC

20 19

1

2

3

18

14

15

16

17

4

5

6

7

8

910 11 12 13

TOP VIEW

(Not to Scale)

AD630

DIFF OFF ADJ

CM OFF ADJ

CM OFF ADJ

CHANNEL STATUS B/A

CH B+

ORDERING GUIDE

Model

Temperature Ranges

Package Description

Package Option

AD630JN

0

°C to 70°C

PDIP

N-20

AD630KN

0

°C to 70°C

PDIP

N-20

AD630AR

–25

°C to +85°C

SOIC

R-20

AD630AR-REEL

–25

°C to +85°CSOIC 13" Tape and Reel R-20

AD630AD

–25

°C to +85°C

SBDIP

D-20

AD630BD

–25

°C to +85°C

SBDIP

D-20

AD630SD

–55

°C to +125°C

SBDIP

D-20

AD630SD/883B

–55

°C to +125°C

SBDIP

D-20

5962-8980701RA

–55

°C to +125°C

SBDIP

D-20

AD630SE/883B

–55

°C to +125°C

CLCC

E-20A

5962-89807012A

–55

°C to +125°C

CLCC

E-20A

AD630JCHIPS

0

°C to 70°C

Chip

AD630SCHIPS

–55

°C to +125°C

Chip

CHIP METALLIZATION AND PINOUT

Dimensions shown in inches and (millimeters).

Contact factory for latest dimensions.

CHIP AVAILABILITY

The AD630 is available in laser trimmed, passivated chip

form. The figure above shows the AD630 metallization pattern,

bonding pads and dimensions. AD630 chips are available; con-

sult factory for details.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the AD630 features proprietary ESD protection circuitry, permanent damage may occur on devices

subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are

recommended to avoid performance degradation or loss of functionality.