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MCP1601 Datasheet(PDF) 15 Page - Microchip Technology |
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MCP1601 Datasheet(HTML) 15 Page - Microchip Technology |
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15 / 24 page  2003-2013 Microchip Technology Inc. DS21762B-page 15 MCP1601 TABLE 5-4: INDUCTOR SUPPLIERS 5.5 Efficiency Efficiency will be affected by the external component selection and the specific operating conditions for the application. In Section 2.0, “Typical Performance Curves”, there are curves plotted using typical induc- tors that can be used to estimate the converter efficiency for 1.2V, 1.8V and 3.3V. 5.6 Printed Circuit Board Layout The MCP1601 is capable of switching over 500 mA at 750 kHz. As with all high-frequency, switch mode, power supplies, a good board layout is essential to pre- venting the noise generated by the power train switch- ing from interfering with the sensing circuitry. The MCP1601 has not demonstrated a sensitivity to layout, but good design practice will prevent undesired results. FIGURE 5-2: Component Placement. When designing a board layout for the MCP1601, the first thing to consider is the physical placement of the external components. In Figure 5-2, SM0805 10 µF ceramic capacitors are used for CIN and COUT. The SM0603 package is used for R1, R2 and C1. The induc- tor used is the Coilcraft® LPO2506 series low profile (0.047” high). The board outline in this example is 1” x 1”. CIN, L and COUT are positioned around the MCP1601 to make the high current paths as short as possible. Supplier L Type Area (mm) Height (mm) DC Resistance Max. Current Series Sumida® 10 µH Unshielded 4.1 mm x 3.8 mm 3.0 mm 230 M 0.76A C32 Sumida® 10 µH Shielded 4.0 mm x 4.0 mm 1.8 mm 160 M 0.66A CDRH3D16 Sumida® 10 µH Shielded 5.7 mm x 5.7 mm 3.0 mm 65 M 1.3A CDRH5D28 CT* 10 µH Shielded 7.3 mm x 7.3 mm 3.5 mm 70 M 1.7A CTCDRH73 Coilcraft® 10 µH Shielded 6.6 mm x 4.5 mm 3.0 mm 75 M 1.0A DS1608 Coilcraft® 15 µH Shielded 6.6 mm x 4.5 mm 3.0 mm 90 M 0.8A DS1608 Coilcraft® 22 µH Shielded 6.6 mm x 4.5 mm 3.0 mm 110 M 0.7A DS1608 Coilcraft® 10 µH Unshielded Wafer 6.0 mm x 5.4 mm 1.3 mm 300 M 0.60A LPO6013 Coilcraft® 15 µH Unshielded Wafer 6.0 mm x 5.4 mm 1.3 mm 380 M 0.55A LPO6013 Taiyo Yuden™ 10 µH Shielded 5.0 mm x 5.0 mm 2.0 mm 66 M 0.7A NP04SB100M Note: CT* = Central Technologies MCP1601 C IN C OUT R 1 C 1 R 2 P GND P GND A GND A GND SILK |
Similar Part No. - MCP1601_13 |
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Similar Description - MCP1601_13 |
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