w9751g6kb-25 datasheet(7/87 Pages) WINBOND

Part #	W9751G6KB-25

Description	Double Data Rate architecture: two data transfers per clock cycle

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Manufacturer	WINBOND [Winbond]

Direct Link	http://www.winbond.com

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W9751G6KB

Publication Release Date: Sep. 03, 2012

- 7 -

Revision A04

6.

BALL DESCRIPTION

BALL NUMBER

SYMBOL

FUNCTION

DESCRIPTION

M8,M3,M7,N2,N8,N3

,N7,P2,P8,P3,M2,P7

,R2

A0

−A12

Address

Provide the row address for active commands, and the column address

and Auto-precharge bit for Read/Write commands to select one

location out of the memory array in the respective bank.

Row address: A0−A12.

Column address: A0−A9. (A10 is used for Auto-precharge)

L2,L3

BA0

−BA1

Bank Select

BA0

−BA1 define to which bank an ACTIVE, READ, WRITE or

PRECHARGE command is being applied.

G8,G2,H7,H3,H1,H9

,F1,F9,C8,C2,D7,D3,

D1,D9,B1,B9

DQ0

−DQ15

Data Input

/ Output

Bi-directional data bus.

K9

ODT

On Die

Termination

Control

ODT (registered HIGH) enables termination resistance internal to the

DDR2 SDRAM.

F7,E8

LDQS,

LDQS LOW Data Strobe

Data Strobe for Lower Byte: Output with read data, input with write data

for source synchronous operation. Edge-aligned with read data, center-

aligned with write data. LDQS corresponds to the data on DQ0

−DQ7.

LDQS is only used when differential data strobe mode is enabled via

the control bit at EMR (1)[A10 EMRS command].

B7,A8

UDQS,

UDQS

UP Data Strobe

Data Strobe for Upper Byte: Output with read data, input with write data

for source synchronous operation. Edge-aligned with read data, center-

aligned

with

write

data.

UDQS

corresponds

to

the

data

on

DQ8

−DQ15. UDQS is only used when differential data strobe mode is

enabled via the control bit at EMR (1)[A10 EMRS command].

L8

CS

Chip Select

All commands are masked when

CS is registered HIGH

. CS provides

for external rank selection on systems with multiple ranks. CS

is

considered part of the command code.

K7,L7,K3

RAS , CAS ,

WE

Command Inputs

RAS , CAS and WE (along with CS ) define the command being

entered.

B3,F3

UDM, LDM

Input Data Mask

DM is an input mask signal for write data. Input data is masked when

DM is sampled high coincident with that input data during a Write

access. DM is sampled on both edges of DQS. Although DM pins are

input only, the DM loading matches the DQ and DQS loading.

J8,K8

CLK, CLK

Differential Clock

Inputs

CLK and CLK are differential clock inputs. All address and control

input signals are sampled on the crossing of the positive edge of CLK

and negative edge of

CLK . Output (read) data is referenced to the

crossings of CLK and CLK (both directions of crossing).

K2

CKE

Clock Enable

CKE

(registered

HIGH)

activates

and

CKE

(registered

LOW)

deactivates clocking circuitry on the DDR2 SDRAM.

J2

VREF

Reference Voltage VREF is reference voltage for inputs.

A1,E1,J9,M9,R1

VDD

Power Supply

Power Supply: 1.8V

 0.1V.

A3,E3,J3,N1,P9

VSS

Ground

Ground.

A9,C1,C3,C7,C9,E9,

G1,G3,G7,G9

VDDQ

DQ Power Supply

DQ Power Supply: 1.8V

 0.1V.

A7,B2,B8,D2,D8,E7,

F2,F8,H2,H8

VSSQ

DQ Ground

DQ Ground. Isolated on the device for improved noise immunity.

A2,E2,L1,R3,R7,R8

NC

No Connection

No connection.

J7

VSSDL

DLL Ground

DLL Ground.

J1

VDDL

DLL Power Supply DLL Power Supply: 1.8V

 0.1V.

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