W9751G6KB-25 datasheet(37/87 Pages) WINBOND

Part #	W9751G6KB-25

Description	Double Data Rate architecture: two data transfers per clock cycle

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Manufacturer	WINBOND [Winbond]

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W9751G6KB

Publication Release Date: Sep. 03, 2012

- 37 -

Revision A04

10. ELECTRICAL CHARACTERISTICS

10.1 Absolute Maximum Ratings

PARAMETER

SYMBOL

RATING

UNIT

NOTES

Voltage on VDD pin relative to VSS

VDD

-1.0 ~ 2.3

V

1, 2

Voltage on VDDQ pin relative to VSS

VDDQ

-0.5 ~ 2.3

V

1, 2

Voltage on VDDL pin relative to VSS

VDDL

-0.5 ~ 2.3

V

1, 2

Voltage on any pin relative to VSS

VIN, VOUT

-0.5 ~ 2.3

V

1, 2

Storage Temperature

TSTG

-55 ~ 150

°C

1, 3

Notes:

1. Stresses gr

eater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a

stress rating only and functional operation of the device at these or any other conditions above those indicated in the

operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended

periods may affect reliability.

2. When VDD and VDDQ and VDDL are less than 500mV; VREF may be equal to or less than 300mV.

3. Storage temperature is the case surface temperature on the center/top side of the DRAM.

10.2 Operating Temperature Condition

PARAMETER

SYMBOL

MIN.

MAX.

UNIT

NOTES

Operating Temperature (for -18/-25/-3)

TCASE

0

85

°C

1, 3, 5

Operating Temperature (for 25I/25A)

TCASE

-40

95

°C

1, 3, 4, 5, 6, 7

Operating Temperature (for 25A)

TA

-40

95

°C

2

Operating Temperature (for 25K)

TCASE

-40

105

°C

1, 3, 4, 5, 6, 8

Operating Temperature (for 25K)

TA

-40

105

°C

2

Notes:

1. Operating case temperature is the case surface temperature on the center/top side of the DRAM.

2. Operating ambient temperature is the surrounding temperature of the DRAM.

3. Supporting 0°C

≤ TCASE ≤ 85°C with full JEDEC AC and DC specifications.

4. Supporting -40°C

≤ TCASE ≤ 85°C with full JEDEC AC and DC specifications.

5. Supporting 0°C

≤ TCASE ≤ 85°C and being able to extend to 95°C with doubling Auto Refresh commands in frequency to a

32 mS period ( tREFI = 3.9 µS) and to enter to Self Refresh mode at this high temperature range via A7

“1” on EMR (2).

6. Supporting -40°C

≤ TCASE ≤ 85°C and being able to extend to 95°C (for 25I/25A) or 105°C (for 25K) with doubling Auto

Refresh commands in frequency to a 32 mS period ( tREFI = 3.9 µS) and to enter to Self Refresh mode at this high

temperature range via A7

“1” on EMR (2).

7. During operation, the DRAM case temperature must be maintained between -40 to 95°C for 25I/25A parts under all

specification parameters.

8. During operation, the DRAM case temperature must be maintained between -40 to 105°C for 25K parts under all

specification parameters.

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