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HCPL-7840-500E Datasheet(PDF) 5 Page - AVAGO TECHNOLOGIES LIMITED |
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HCPL-7840-500E Datasheet(HTML) 5 Page - AVAGO TECHNOLOGIES LIMITED |
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5 / 19 page  5 Solder Reflow Temperature Profile Recommended Pb-Free IR Profile 0 TIME (SECONDS) 200 100 50 150 100 200 250 300 0 30 SEC. 50 SEC. 30 SEC. 160°C 140°C 150°C PEAK TEMP. 245°C PEAK TEMP. 240°C PEAK TEMP. 230°C SOLDERING TIME 200°C PREHEATING TIME 150°C, 90 + 30 SEC. 2.5°C ± 0.5°C/SEC. 3°C + 1°C/–0.5°C TIGHT TYPICAL LOOSE ROOM TEMPERATURE PREHEATING RATE 3°C + 1°C/–0.5°C/SEC. REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. 217 °C RAMP-DOWN 6 °C/SEC. MAX. RAMP-UP 3 °C/SEC. MAX. 150 - 200 °C 260 +0/-5 °C t 25 °C to PEAK 60 to 150 SEC. 20-40 SEC. TIME WITHIN 5 °C of ACTUAL PEAK TEMPERATURE tp ts PREHEAT 60 to 180 SEC. tL TL Tsmax Tsmin 25 Tp TIME NOTES: THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX. Tsmax = 200 °C, Tsmin = 150 °C Note: Non-halide flux should be used.. Note: Non-halide flux should be used. |
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