S29AL016J70TFI020 datasheet(55/58 Pages) SPANSION

Part #	S29AL016J70TFI020

Description	CMOS 3.0 Volt-only Boot Sector Flash Memory

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Manufacturer	SPANSION [SPANSION]

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April 12, 2012 S29AL016J_00_12

S29AL016J

55

Data

She e t

20.3

LAE064–64-Ball Fortified Ball Grid Array (BGA) 9 mm x 9 mm

PACKAGE

LAE 064

JEDEC

N/A

9.00 mm x 9.00 mm

PACKAGE

SYMBOL

MIN

NOM

MAX

NOTE

A

---

1.40

PROFILE HEIGHT

A1

0.40

---

STANDOFF

A2

0.60

---

BODY THICKNESS

D

9.00 BSC.

BODY SIZE

E

9.00 BSC.

BODY SIZE

D1

7.00 BSC.

MATRIX FOOTPRINT

E1

7.00 BSC.

MATRIX FOOTPRINT

MD

8

MATRIX SIZE D DIRECTION

ME

8

MATRIX SIZE E DIRECTION

N

64

BALL COUNT

φb

0.50

0.60

0.70

BALL DIAMETER

eD

1.00 BSC.

BALL PITCH - D DIRECTION

eE

1.00 BSC.

BALL PITCH - E DIRECTION

SD / SE

0.50 BSC.

SOLDER BALL PLACEMENT

NONE

DEPOPULATED SOLDER BALLS

3623 \ 16-038.12 \ 1.16.07

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.

2. ALL DIMENSIONS ARE IN MILLIMETERS.

3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010

EXCEPT AS NOTED).

4.

e REPRESENTS THE SOLDER BALL GRID PITCH.

5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE

"D" DIRECTION.

SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE

"E" DIRECTION.

N IS THE TOTAL NUMBER OF SOLDER BALLS.

6

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL

DIAMETER IN A PLANE PARALLEL TO DATUM C.

7

SD AND SE ARE MEASURED WITH RESPECT TO DATUMS

A AND B AND DEFINE THE POSITION OF THE CENTER

SOLDER BALL IN THE OUTER ROW.

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN

THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,

RESPECTIVELY, SD OR SE = 0.000.

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN

THE OUTER ROW, SD OR SE = e/2

8. NOT USED.

9. "+" INDICATES THE THEORETICAL CENTER OF

DEPOPULATED BALLS.

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S29AL016J70TFI020 Datasheet(PDF) 55 Page - SPANSION

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