S29AL016J70TFI020 datasheet(54/58 Pages) SPANSION

Part #	S29AL016J70TFI020

Description	CMOS 3.0 Volt-only Boot Sector Flash Memory

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Manufacturer	SPANSION [SPANSION]

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54

S29AL016J

S29AL016J_00_12 April 12, 2012

Da ta

Sh e e t

20.2

VBK048—48-Ball Fine-Pitch Ball Grid Array (BGA) 8.15 mm x 6.15 mm

3338 \ 16-038.25b

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.

2. ALL DIMENSIONS ARE IN MILLIMETERS.

3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT

AS NOTED).

4.

e REPRESENTS THE SOLDER BALL GRID PITCH.

5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE

"D" DIRECTION.

SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE

"E" DIRECTION.

N IS THE TOTAL NUMBER OF SOLDER BALLS.

6

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL

DIAMETER IN A PLANE PARALLEL TO DATUM C.

7

SD AND SE ARE MEASURED WITH RESPECT TO DATUMS

A AND B AND DEFINE THE POSITION OF THE CENTER

SOLDER BALL IN THE OUTER ROW.

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN

THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,

RESPECTIVELY, SD OR SE = 0.000.

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN

THE OUTER ROW, SD OR SE = e/2

8. NOT USED.

9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED

BALLS.

10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK

MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.

SIDE VIEW

TOP VIEW

SEATING PLANE

A2

A

(4X)

0.10

10

D

E

C

0.10

A1

C

B

A

C

0.08

BOTTOM VIEW

A1 CORNER

B

A

M

φ 0.15

C

M

7

6

e

SE

SD

6

5

4

3

2

A

B

C

D

E

F

G

1

H

φb

E1

D1

C

φ 0.08

PIN A1

CORNER

INDEX MARK

PACKAGE

VBK 048

JEDEC

N/A

8.15 mm x 6.15 mm NOM

PACKAGE

SYMBOL

MIN

NOM

MAX

NOTE

A

---

1.00

OVERALL THICKNESS

A1

0.18

---

BALL HEIGHT

A2

0.62

---

0.76

BODY THICKNESS

D

8.15 BSC.

BODY SIZE

E

6.15 BSC.

BODY SIZE

D1

5.60 BSC.

BALL FOOTPRINT

E1

4.00 BSC.

BALL FOOTPRINT

MD

8

ROW MATRIX SIZE D DIRECTION

ME

6

ROW MATRIX SIZE E DIRECTION

N

48

TOTAL BALL COUNT

φb

0.35

---

0.43

BALL DIAMETER

e

0.80 BSC.

BALL PITCH

SD / SE

0.40 BSC.

SOLDER BALL PLACEMENT

---

DEPOPULATED SOLDER BALLS

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S29AL016J70TFI020 Datasheet(PDF) 54 Page - SPANSION

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