RC1585

PRODUCT

SPECIFICATION

8

Assumptions:

•

•

•

•

•

Θ

and a thermally conductive material)

The power dissipation in this application is:

From the specification table, for the power section:

= 60 + (10.7) * (5 + 3) = 146

°C

For the control section:

60 + (10.7) * (5 + 0.7) = 121

°C

In each case, the junction temperature is below the

maximum rating.

Table 1. Bill of Materials for Application Circuit for the RC1585

Item

Quantity

Manufacturer

Part Number

Description

C1

1

Xicon

L10V10

10

µF, 10V Aluminum

C2, C3

2

Xicon

L10V100

100

µF, 10V Aluminum

R1

1

Generic

124

Ω, 1%

R2

1

Generic

24.9

Ω, 1%

U1

1

Fairchild

RC1585T

5A Regulator

Figure 14. Application Circuit (RC1585)

R2

24.9

Ω

R1

124

Ω

C1

10

µF

C2

100

µF

1.5V

U1

RC1585

ADJ

+

+

+

C3

100

µF

+

+

+

+

Junction-to-case thermal resistance is specified

from the IC junction to the bottom of the case

directly below the die. This is the lowest resistance

path for heat flow. Proper mounting ensures the

best thermal flow from this area of the package to

the heat sink. Use of a thermally conductive

material at the case-to-heat sink interface is

recommended. Use a thermally conductive spacer

if the case of the device must be electrically

isolated and include its contribution to the total

thermal resistance. The cases of the RC1585 series

are directly connected to the output of the device.