NCP1608

http://onsemi.com

3

Table 1. PIN FUNCTION DESCRIPTION

Pin

Name

Function

1

FB

tain regulation. The feedback voltage is used for overvoltage and undervoltage protections. The controller is disabled

2

Control

The Control pin is the output of the internal error amplifier. A compensation network is connected between the Control pin

and ground to set the loop bandwidth. A low bandwidth yields a high power factor and a low Total Harmonic Distortion (THD).

3

Ct

The Ct pin sources a current to charge an external timing capacitor. The circuit controls the power switch on time by com-

end of the on time.

4

CS

turns off. The sense resistor that connects to the CS pin programs the maximum switch current.

5

ZCD

The voltage of an auxiliary winding is sensed by this pin to detect the inductor demagnetization for CrM operation.

6

GND

The GND pin is analog ground.

7

DRV

The integrated driver has a typical source impedance of 12 W and a typical sink impedance of 6 W.

8

Table 2. MAXIMUM RATINGS

Rating

Symbol

Value

Unit

FB Voltage

−0.3 to 10

V

FB Current

±10

mA

Control Voltage

−0.3 to 6.5

V

Control Current

−2 to 10

mA

Ct Voltage

−0.3 to 6

V

Ct Current

±10

mA

CS Voltage

−0.3 to 6

V

CS Current

±10

mA

ZCD Voltage

−0.3 to 10

V

ZCD Current

±10

mA

DRV Voltage

V

DRV Sink Current

800

mA

DRV Source Current

500

mA

Supply Voltage

−0.3 to 20

V

Supply Current

±20

mA

450

mW

Thermal Resistance Junction−to−Ambient

Junction−to−Air, Low conductivity PCB (Note 3)

Junction−to−Air, High conductivity PCB (Note 4)

178

168

127

°C/W

Operating Junction Temperature Range

−40 to 125

°C

Maximum Junction Temperature

150

°C

Storage Temperature Range

−65 to 150

°C

Lead Temperature (Soldering, 10 s)

300

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device series contains ESD protection and exceeds the following tests:

Pins 1– 8: Human Body Model 2000 V per JEDEC Standard JESD22−A114E.

2. This device contains Latch−Up protection and exceeds ± 100 mA per JEDEC Standard JESD78.

a JEDEC 51 low conductivity test PCB. Test conditions were under natural convection or zero air flow.

for a JEDEC 51 high conductivity test PCB. Test conditions were under natural convection or zero air flow.