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RT8525D Datasheet(PDF) 11 Page - Richtek Technology Corporation |
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RT8525D Datasheet(HTML) 11 Page - Richtek Technology Corporation |
11 / 12 page 11 RT8525D DS8525D-00 June 2012 www.richtek.com © Copyright 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. Layout Considerations PCB layout is very important for designing switching power converter circuits. The following layout guides should be strictly followed for best performance of the RT8525D. The power components L1, D1, CIN, COUT, M1 and RS must be placed as close as possible to reduce current loop. The PCB trace between power components must be as short and wide as possible. Place components RFB1 and RFB2 close to IC as possible. The trace should be kept away from the power loops and shielded with a ground trace to prevent any noise coupling. The compensation circuit should be kept away from the power loops and should be shielded with a ground trace to prevent any noise coupling. Place the compensation components to the COMP pin as close as possible, no matter the compensation is RC, CC1 or CC2. Figure 5. PCB Layout Guide The compensation circuit should be kept away from the power loops and should be shielded with a ground trace to prevent any noise coupling. Place the power components as Close as possible. The traces should be wide and short especially for the high current loop. The feedback voltage divider resistors must near the feedback pin. The divider center trace must be shorter and avoid the trace near any switching nodes. VDC VIN FSW SS EN DRV GND OVP ISW COMP FAULT FB 11 10 9 1 2 3 4 5 12 67 8 13 M1 GND VIN CIN VIN L1 COUT D1 VOUT RS GND RSLP VOUT RFB2 RFB1 RC CC1 CC2 GND Figure 4. Derating Curve of Maximum Power Dissipation 0.00 0.15 0.30 0.45 0.60 0.75 0.90 1.05 1.20 1.35 1.50 1.65 1.80 0 255075 100 125 Ambient Temperature (°C) Four-Layer PCB resistance, θJA. The derating curve in Figure 4 allows the designer to see the effect of rising ambient temperature on the maximum power dissipation. |
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