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RT8206M Datasheet(PDF) 25 Page - Richtek Technology Corporation |
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RT8206M Datasheet(HTML) 25 Page - Richtek Technology Corporation |
25 / 27 page ![]() RT8206L/M 25 DS8206L/M-07 June 2012 www.richtek.com © Copyright 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. Layout Considerations Layout is very important in high frequency switching converter design. If the layout is designed improperly, the PCB could radiate excessive noise and contribute to the converter instability. The following guidelines must be strictly followed for a proper layout of RT8206L/M. Connect an RC low-pass filter from PVCC to VCC. The RC low-pass filter is composed of an external capacitor and an internal 10 Ω resistor. It is recommended to bypass VCC to GND with a 1 μF capacitor. Place the capacitor close to the IC, within 12mm (0.5 inch) if possible. Keep current limit setting network as close as possible to the IC. Routing of the network should avoid coupling to high-voltage switching node. Connections from the drivers to the respective gate of the high side or the low-side MOSFET should be as short as possible to reduce stray inductance. Use 0.65mm (25 mils) or wider trace. All sensitive analog traces and components such as VOUTx, FBx, GND, ENx, PGOODx, ILIMx, VCC, and TON should be placed away from high voltage switching nodes such as PHASEx, LGATEx, UGATEx or BOOTx nodes to avoid coupling. Use internal layer(s) as ground plane(s) and shield the feedback trace from power traces and components. Gather ground terminal of VIN capacitor(s), VOUTx capacitor(s), and source of low side MOSFETs as close as possible. PCB trace of the PHASEx node, which connects to source of high side MOSFET, drain of low side MOSFET and high voltage side of the inductor, should be as short and wide as possible. Figure 7. Derating Curve of Maximum Power Dissipation 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 0 25 50 75 100 125 Ambient Temperature (°C) Four-Layer PCB PD(MAX) = (125 °C − 25°C) / (36°C/W) = 2.778W for WQFN-32L 5x5 package The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA. The derating curve in the Figure 7 allows the designer to see the effect of rising ambient temperature on the maximum power dissipation. |
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