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VER C.0

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OSM5XNE1E1E

VER C.2

■ Soldering Heat Reliability (DIP):

Reflow soldering Profile

· Reflow soldering should not be done more than two times.

· When soldering, do not put stress on the LEDs during heating.

· After soldering, do not warp the circuit board.

· Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,

a double-head soldering iron should be used.

It should be confirmed beforehand whether the

characteristics of the LEDs will or will not be damaged by repairing.

Solder

Average ramp-up rate = 3ºC/sec. max.

Preheat temperature: 150º~180ºC

Preheat time = 120 sec. max.

Ramp-down rate = 6ºC/sec. max.

Peak temperature = 220ºC max.

Time within 3ºC of actual

peak temperature = 25 sec. max.

Duration above 200ºC is 40 sec. max.

LED & Application Technologies