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Temperature Profile

HRS test condition

Solder method

:Reflow, IR/hot air

Environment

:Room air

Solder composition

:Paste, 96.5%Sn/3.0%Ag/0.5%Cu

(Senju Metal Industry, Co., Ltd.'s Part

Number:M705-221CM5-32-10.5)

Test board

:Glass epoxy 30mm×60mm×0.8mm thick

Land dimensions

:0.3mm×0.65mm, 0.3mm×1.2mm

Metal mask

:0.25×0.65, 0.2×0.1mm thick

The temperature profiles shown are based on the above conditions.

In individual applications the actual temperature may vary,

depending on solder paste type, volume / thickness and board size /

thickness. Consult your solder paste and equipment manufacturer for

specific recommendations.

MAX 250℃

Start

Time(Seconds)

25℃（60sec.）

（60sec.）

90~120sec.

Preheating

soldering

0

50

100

150

150℃

200℃

230℃

200

250

Temperature (ç)

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.