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CXD2724AQ-3 Datasheet(PDF) 65 Page - Sony Corporation |
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CXD2724AQ-3 Datasheet(HTML) 65 Page - Sony Corporation |
65 / 65 page – 65 – CXD2724AQ-3 Package Outline Unit: mm PACKAGE STRUCTURE SONY CODE EIAJ CODE JEDEC CODE QFP-80P-L01 QFP080-P-1420 PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING 42/COPPER ALLOY 1.6g 23.9 ± 0.4 20.0 – 0.1 + 0.4 1 80 65 64 41 40 25 24 0.8 0.35 – 0.1 + 0.15 0.1 – 0.05 + 0.2 2.75 – 0.15 + 0.35 0.15 – 0.05 + 0.1 80PIN QFP (PLASTIC) M 0.2 0.15 0° to 10° DETAIL A A |
Similar Part No. - CXD2724AQ-3 |
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Similar Description - CXD2724AQ-3 |
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