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mlci0109_reli-PRP13

mlci0109_reli_e-01

＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors

1. Circuit Design

Precautions

◆Verification of operating environment, electrical rating and performance

1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications.

As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from

components used in general purpose applications.

◆Operating Current（Verification of Rated current）

1. The operating current for inductors must always be lower than their rated values.

2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.

2. PCB Design

Precautions

◆Pattern configurations（Design of Land-patterns）

1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor performance.

Therefore, the following items must be carefully considered in the design of solder land patterns:

（1）The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when

designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of

solder necessary to form the fillets.

（2）When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated

by solder-resist.

（3）The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to design land patterns

smaller than terminal electrode of chips.

◆Pattern configurations（Inductor layout on panelized［breakaway］PC boards）

1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processes（PCB cutting,

board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.）For this reason, planning pattern

configurations and the position of SMD inductors should be carefully performed to minimize stress.

Technical

consider-

ations

◆Pattern configurations（Design of Land-patterns）

1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts（larger fillets which extend above

the component end terminations）.Examples of improper pattern designs are also shown.

（1）Recommended land dimensions for a typical chip inductor land patterns for PCBs

Recommended land dimensions for wave-soldering

Recommended land dimensions for reflow-soldering

Type

1608

2125

3216

L

1.6

2.0

3.2

W

0.8

1.25

1.6

A

0.8～1.0 1.0～1.4 1.8～2.5

B

0.5～0.8 0.8～1.5 0.8～1.7

C

0.6～0.8 0.9～1.2 1.2～1.6

（Unit：mm）

Type

0402

0603

1005

105

1608

2012

2125

2016

3216

2520

L

0.4

0.6

1.0

1.0

1.6

2.0

2.0

2.0

3.2

2.5

W

0.2

0.3

0.5

0.6

0.8

1.25

1.25

1.6

1.6

2.0

A

0.15～0.25 0.20～0.30 0.45～0.55 0.50～0.55 0.8～1.0 0.8～1.2 0.8～1.2 0.8～1.2 1.8～2.5 1.0～1.4

B

0.10～0.20 0.20～0.30 0.40～0.50 0.30～0.40 0.6～0.8 0.8～1.2 0.8～1.2 0.8～1.2 0.6～1.5 0.6～1.0

C

0.15～0.30 0.25～0.40 0.45～0.55 0.60～0.70 0.6～0.8 0.9～1.6 0.9～1.6 1.2～2.0 1.2～2.0 1.8～2.2

（Unit：mm）

Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns.

Recommended land dimension for Reflow-soldering

Type

3216

2010

L

3.2

2.0

W

1.6

1.0

a

0.7～0.9

0.5～0.6

b

0.8～1.0

0.5～0.6

c

0.4～0.5

0.2～0.3

d

0.8

0.5

（Unit：mm）

（2）Examples of good and bad solder application

Item

Not recommended

Recommended

Mixed mounting of SMD

and leaded components

Component placement

close to the chassis

Hand-soldering of leaded

components near mounted

components

Horizontal component

placement

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