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mlci0109_reli-PRP8

mlci0109_reli_e-01

＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

Multilayer chip inductors and beads

10. Resistance to Flexure of Substrate

BK0402

No mechanical damage.

BK0603

BK1005

BKH1005

BK1608

BK2125

ARRAY

BK2010

BK3216

BKP0603

BKP1005

BKP1608

BKP2125

CK1608

CK2125

CKS2125

CKP2012

CKP2016

CKP2520

NM2012

NM2520

LK1005

LK1608

LK2125

HK0402

HK0603

HK1005

HK1608

HK2125

HKQ0603S

HKQ0603U

AQ105

【Test Methods and Remarks】

Warp：2mm（BK Series without 0402size, BKP, BKH, CK, CKS, CKP, NM, LK, HK, HKQ, AQ Series）

：1mm（BK0402, HK0402 Series）

Testing board：glass epoxy-resin substrate

Thickness：0.8mm

11. Solderability

BK0402

At least 75％ of terminal electrode is covered by new solder.

BK0603

BK1005

BKH1005

BK1608

BK2125

ARRAY

BK2010

BK3216

BKP0603

BKP1005

BKP1608

BKP2125

CK1608

At least 75％ of terminal electrode is covered by new solder.

CK2125

CKS2125

CKP2012

CKP2016

CKP2520

NM2012

NM2520

LK1005

LK1608

LK2125

HK0402

HK0603

HK1005

HK1608

HK2125

HKQ0603S

HKQ0603U

AQ105

【Test Methods and Remarks】

Solder temperature：230±5℃

Duration：4±1 sec.