TLC2810Z, TLC2810Y

LinCMOS

™ PRECISION

DUAL OPERATIONAL AMPLIFIERS

SLOS120A – AUGUST 1993 – REVISED AUGUST 1994

2

POST OFFICE BOX 655303

TLC2810Y chip information

This chip, when properly assembled, displays characteristics similar to the TLC2810Z. Thermal compression

or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with

conductive epoxy or a gold-silicon preform.

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJmax = 165°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (4) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

+

–

1OUT

1IN +

1IN –

VDD

GND

(8)

(1)

(3)

(2)

(4)

BONDING PAD ASSIGNMENTS

+

–

2OUT

2IN +

2IN –

(7)

(5)

(6)

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

72

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