1

10

2

9

3

8

4

7

V

CC

S

D+

D–

OE

1D+

1D–

2D+

2D–

GND

5

6

1

10

2

9

3

8

4

7

V

CC

S

D+

D–

OE

1D+

1D–

2D+

2D–

GND

5

6

TS3USB221A-Q1

www.ti.com

SCDS300B

– JULY 2010 – REVISED JULY 2011

ESD PROTECTED, HIGH-SPEED USB 2.0 (480-Mbps)

1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE

Check for Samples: TS3USB221A-Q1

1

FEATURES

•

Qualified for Automotive Applications

•

ESD Performance Tested Per JESD 22

•

– 7000-V Human-Body Model

(A114-B, Class II)

•

– 1000-V Charged-Device Model (C101)

•

1.8-V Compatible Control-Pin Inputs

•

ESD Performance I/O to GND

•

Low-Power Mode When OE Is Disabled (1

μA)

– 12-kV Human-Body Model

•

•

APPLICATIONS

•

•

Routes Signals for USB 1.0, 1.1, and 2.0

•

Low Power Consumption (30

μA Maximum)

•

High Bandwidth (900 MHz Typical)

RSE PACKAGE

RSE PACKAGE

(TOP VIEW)

(BOTTOM VIEW)

DESCRIPTION

The TS3USB221A is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals

in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or

controllers with limited USB I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with

minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of

two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals

at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible

with various standards, such as high-speed USB 2.0 (480 Mbps).

The TS3USB221A integrates ESD protection cells on all pins, is available in a tiny

μQFN package (2.0 mm × 1.5

mm) and is charaterized over the free air temperature range from

–40°C to 125°C.

ORDERABLE PART NUMBER

TOP-SIDE MARKING

–40°C to 125°C

QFN

– RSE

Reel of 3000

TS3USB221AQRSERQ1

OFW

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright

© 2010–2011, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.