EN_DCDC1

ENABLE

VCC

VLDO1

200 mA LDO

VLDO1

VLDO2

VINDCDC1

VLDO2

200 mA LDO

VIN_LDO

ENABLE

VIN

MODE

1 mF

1R

10 mF

TPS650250

EN_LDO

Vbat

PWRFAIL

AGND1

I/Ovoltage

R19

L1

DEFDCDC1

VDCDC1

PGND1

DCDC1 (I/O)

STEP-DOWN

CONVERTER

1600 mA

R1

R2

EN_DCDC2

VINDCDC2

L2

DEFDCDC2

VDCDC2

PGND2

DCDC2

(memory)

STEP-DOWN

CONVERTER

800 mA

R3

R4

EN_DCDC3

VINDCDC3

L3

DEFDCDC3

VDCDC3

PGND3

DCDC3 (core)

STEP-DOWN

CONVERTER

800 mA

R7

R8

Vbat

Vbat

Vbat

Vdd_alive

VLDO3

30 mA LDO

2.2 mF

1 V

3.3 V / 2.8 V

oradjustable

2.5 V / 1.8 V

oradjustable

VCC

PWRFAIL_SNS

Vbat

Vref=1V

+

-

R11

R12

AGND2

PWM/ PFM

EN_Vdd_alive

ENABLE

R9

R10

R5

R6

10 mF

ENABLE

10 mF

ENABLE

2.2 mF

2.2 mF

22 mF

2.2 mH

22 mF

2.2 mH

22 mF

2.2 mH

FB_LDO1

FB_LDO2

TPS650250-Q1

SLVSAA7 – MARCH 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

Functional Block Diagram

VOLTAGE AT

OUTPUT CURRENT ON

VOLTAGE AT

ORDERABLE PART

TOP-SIDE

PACKAGE

DCDC3

DCDC1 / DCDC2 / DCDC3

VDD_ALIVE

MARKING

32-Pin QFN

–40°C to 125°C

Adjustable

1.6A / 0.8A / 0.8A

1V

TPS650250QRHBRQ1

TPS650250Q

(RHB)

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

2

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Copyright © 2010, Texas Instruments Incorporated

Product Folder Link(s): TPS650250-Q1