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TPS65023-Q1 Datasheet(PDF) 2 Page - Texas Instruments |
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TPS65023-Q1 Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 53 page  TPS65023-Q1 SLVS927D – MARCH 2009 – REVISED SEPTEMBER 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VI Input voltage range on all pins except AGND and PGND pins with respect to AGND –0.3 V to 7 V Current at VINDCDC1, L1, PGND1, VINDCDC2, L2, PGND2, VINDCDC3, L3, PGND3 2000 mA Peak current at all other pins 1000 mA Continuous total power dissipation See Dissipation Rating Table TA Operating free-air temperature –40°C to 125°C TJ Maximum junction temperature 125 °C Tstg Storage temperature –65°C to 150°C Human-body model (HBM) 2000 V RHA package Machine model (MM) 50 V Charged-device model (CDM) 750 V ESD Electrostatic discharge protection Human-body model (HBM) 2000 V RSB package Machine model (MM) 100 V Charged-device model (CDM) 1000 V (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability THERMAL INFORMATION TPS65023-Q1 THERMAL METRIC(1) RHA UNITS 40 PINS θJA Junction-to-ambient thermal resistance 31.6 θJCtop Junction-to-case (top) thermal resistance 18.2 θJB Junction-to-board thermal resistance 6.6 °C/W ψJT Junction-to-top characterization parameter 0.2 ψJB Junction-to-board characterization parameter 6.5 θJCbot Junction-to-case (bottom) thermal resistance 1.7 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. DISSIPATION RATINGS THERMAL RESISTANCE, TA ≤ 25°C TA = 70°C TA = 85°C PACKAGE JUNCTION TO AMBIENT POWER RATING POWER RATING POWER RATING (RθJA) RSB(1) 2.65 W 39 °C/W 1.41 W 1.025 W RHA(2) 3.175 W 31.5 °C/W 1.746 W 1.269 W (1) The thermal resistance, junction-to-ambient (RθJA), of the RSB package is 39°C/W measured on a high-K board. (2) The thermal resistance, junction-to-ambient (RθJA), of the RHA package is 31.5°C/W measured on a high-K board. 2 Submit Documentation Feedback Copyright © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): TPS65023-Q1 |
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