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PCM2903B Datasheet(PDF) 2 Page - Texas Instruments

Part # PCM2903B
Description  STEREO AUDIO CODEC WITH USB INTERFACE, SINGLE-ENDED ANALOG INPUT/OUTPUT, AND S/PDIF
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

PCM2903B Datasheet(HTML) 2 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
(1)
PCM2903B
SLES228 – DECEMBER 2008 ........................................................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION(1)
SPECIFIED
TRANSPORT
PACKAGE
TEMPERATURE
PACKAGE
ORDERING
MEDIA,
PRODUCT
PACKAGE-LEAD
DESIGNATOR
RANGE
MARKING
NUMBER
QUANTITY
PCM2903BDB
Rails, 47
PCM2903BDB
SSOP-28
DB
–25°C to 85°C
PCM2903B
Tape and Reel,
PCM2903BDBR
2000
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Over operating free-air temperature range (unless otherwise noted).
PARAMETER
PCM2903B
UNIT
Supply voltage, VCCC, VCCP1, VCCP2, VCCX, VDD
–0.3 to 4
V
Supply voltage differences, VCCC, VCCP1, VCCP2, VCCX, VDD
±0.1
V
Ground voltage differences, AGNDC, AGNDP, AGNDX, DGND, DGNDU
±0.1
V
SEL0, SEL1, DIN
–0.3 to 6.5
V
Digital input voltage
D+, D–, HID0, HID1, HID2, XTI, XTO, DOUT, SSPND
–0.3 to (VDD + 0.3) < 4
V
Analog input voltage VINL, VINR, VCOM, VOUTR, VOUTL
–0.3 to (VCCC + 0.3) < 4
V
Input current (any pins except supplies)
±10
mA
Ambient temperature under bias
–40 to +125
°C
Storage temperature, Tstg
–55 to +150
°C
Junction temperature TJ
+150
°C
Lead temperature (soldering, 5s)
+260
°C
Package temperature (IR reflow, peak)
+250
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2
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Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): PCM2903B


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