NOTE: UNLESS OTHERWISE SPECIFIED

1. EPOXY COATING

2. 63Sn/37Pb EUTECTIC BUMP

3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.

4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION REMAINING PINS ARE NUMBERED

COUNTERCLOCKWISE.

PACKAGE HEIGHT.

6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.

8-Bump (12 mil) micro SMD Package

NS Package TLA08AAA

X

X

X

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL

COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or

systems which, (a) are intended for surgical implant

into the body, or (b) support or sustain life, and

whose failure to perform when properly used in

accordance with instructions for use provided in the

labeling, can be reasonably expected to result in a

significant injury to the user.

2. A critical component is any component of a life

support device or system whose failure to perform

can be reasonably expected to cause the failure of

the life support device or system, or to affect its

safety or effectiveness.

National Semiconductor

Corporation

Americas

Email: support@nsc.com

National Semiconductor

Europe

Fax: +49 (0) 180-530 85 86

Email: europe.support@nsc.com

Deutsch Tel: +49 (0) 69 9508 6208

English

Tel: +44 (0) 870 24 0 2171

Français Tel: +33 (0) 1 41 91 8790

National Semiconductor

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Response Group

Tel: 65-2544466

Fax: 65-2504466

Email: ap.support@nsc.com

National Semiconductor

Japan Ltd.

Tel: 81-3-5639-7560

Fax: 81-3-5639-7507

www.national.com

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.