ISO7220A-Q1

ISO7221A-Q1

ISO7221C-Q1

www.ti.com

SLLS965C – JULY 2009 – REVISED MAY 2012

DEVICE INFORMATION

IEC PACKAGE CHARACTERISTICS

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

L(I01)

Minimum air gap (clearance)

Shortest terminal-to-terminal distance through air

4.8

mm

SOIC-8

Minimum external tracking

Shortest terminal-to-terminal distance across the

L(I02)

4.3

mm

(creepage)

package surface

Tracking resistance

CTI

DIN IEC 60112 / VDE 0303 Part 1

≥175

V

(comparative tracking index)

Minimum internal gap (internal

Distance through the insulation

0.008

mm

clearance)

Ω

Isolation resistance

Ω

Barrier capacitance input to

1

pF

output

Input capacitance to ground

1

pF

NOTE: Creepage and clearance requirements should be applied according to the specific equipment isolation

standards of an application. Care should be taken to maintain the creepage and clearance distance of a board

design to ensure that the mounting pads of the isolator on the printed circuit board do not reduce this distance.

Creepage and clearance on a printed circuit board become equal according to the measurement techniques

shown in the Isolation Glossary . Techniques such as inserting grooves and/or ribs on a printed circuit board are

used to help increase these specifications.

IEC 60664-1 RATINGS TABLE

PARAMETER

TEST CONDITIONS

SPECIFICATION

Basic isolation group

Material group

IIIa

Rated mains voltage

≤150 VRMS

I-IV

Installation classification

Rated mains voltage

≤300 VRMS

I-III

Rated mains voltage

≤400 VRMS

I-II

IEC 60747-5-2 INSULATION CHARACTERISTICS

(1)

PARAMETER

TEST CONDITIONS

SPECIFICATION

UNIT

Maximum working insulation voltage

560

V

Input to output test voltage

100% Production test with t = 1 s,

1050

V

Partial discharge <5 pC

Transient overvoltage

t = 60 s

4000

V

Insulation resistance

Ω

Pollution degree

2

(1)

Climatic Classification 40/125/21

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