MCM72F10

5

MOTOROLA FAST SRAM

Rating

Symbol

Value

Unit

Power Supply Voltage

VDD

– 0.5 to + 4.6

V

Voltage Relative to VSS

(See Note 2)

Vin, Vout

– 0.5 to VDD + 0.5

V

Input Voltage Three State I/O

(See Note 2)

VIT

VSS – 0.5 to VDD + 0.5

V

Output Current (per I/O)

Iout

± 20

mA

Power Dissipation

PD

4.6

W

Temperature Under Bias

Tbias

– 10 to + 85

°C

Storage Temperature

Tstg

– 55 to + 125

°C

NOTES:

1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are

exceeded. Functional operation should be restricted to RECOMMENDED OPER-

ATING CONDITIONS. Exposure to higher than recommended voltages for extended

periods of time could affect device reliability.

2. This is a steady–state DC parameter that is in effect after the power supply has

achieved its nominal operating level. Power sequencing can not be controlled and

is not allowed.

3. Power dissipation capability is dependent upon package characteristics and use

environment. See Package Thermal Characteristics.

PACKAGE THERMAL CHARACTERISTICS — PBGA

Rating

Symbol

Max

Unit

Notes

Junction to Ambient (@ 200 lfm)

Single Layer Board

Four Layer Board

R

θJA

41

19

°C/W

1, 2

Junction to Board (Bottom)

R

θJB

11

°C/W

3

Junction to Case (Top)

R

θJC

19

°C/W

4

NOTES:

1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient

temperature, air flow, board population, and board thermal resistance.

2. Per SEMI G38–87.

3. Indicates the average thermal resistance between the die and the printed circuit board.

4. Indicates the average thermal resistance between the die and the case top surface via the cold plate method (MIL SPEC–883 Method

1012.1).

This device contains circuitry to protect the

inputs against damage due to high static volt-

ages or electric fields; however, it is advised that

normal precautions be taken to avoid application

of any voltage higher than maximum rated volt-

ages to this high–impedance circuit.