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PCM2906C Datasheet(PDF) 2 Page - Texas Instruments |
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PCM2906C Datasheet(HTML) 2 Page - Texas Instruments |
2 / 30 page ![]() PCM2906C SBFS037 – NOVEMBER 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGING/ORDERING INFORMATION(1) SPECIFIED TRANSPORT PACKAGE TEMPERATURE PACKAGE ORDERING MEDIA, PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER QUANTITY PCM2906CDB Rails, 47 PCM2906CDB SSOP-28 DB –25°C to +85°C PCM2906C Tape and Reel, PCM2906CDBR 2000 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). PARAMETER PCM2906C UNIT Supply voltage, VBUS –0.3 to 6.5 V Ground voltage differences, AGNDC, AGNDP, AGNDX, DGND, DGNDU ±0.1 V SEL0, SEL1, DIN –0.3 to 6.5 Digital input voltage V D+, D –, HID0, HID1, HID2, XTI, XTO, DOUT, SSPND –0.3 to (VDDI + 0.3) < 4 VINL, VINR, VCOM, VOUTR, VOUTL –0.3 to (VCCCI + 0.3) < 4 Analog input voltage V VCCCI, VCCP1I, VCCP2I, VCCXI, VDDI –0.3 to 4 Input current (any pins except supplies) ±10 mA Ambient temperature under bias –40 to +125 °C Storage temperature, Tstg –55 to +150 °C Junction temperature, TJ +150 °C Lead temperature (soldering, 5s) +260 °C Package temperature (IR reflow, peak) +250 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL INFORMATION PCM2906C THERMAL METRIC(1) DB (SSOP) UNITS 28 PINS θJA Junction-to-ambient thermal resistance 64.5 θJCtop Junction-to-case (top) thermal resistance 24.5 θJB Junction-to-board thermal resistance 25.4 °C/W ψJT Junction-to-top characterization parameter 2.0 ψJB Junction-to-board characterization parameter 25.0 θJCbot Junction-to-case (bottom) thermal resistance N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): PCM2906C |
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