CGY 196

Siemens Aktiengesellschaft

3

16.6.1998

HL HF PE GaAs

Permissible Total Power Dissipation in DC Operation

75

0

200

400

600

800

1000

1200

1400

1600

0

25

50

75

100

125

150

Temperature of soldering point, Ts

°C

mW

Determination of Permissible Total Power Dissipation for Continuous and Pulse

Operation

The dissipated power is the power which remains in the chip and heats the device. It does

not contain RF signals which are coupled out consistently.

a) Continuous Wave / DC Operation

cases:

• When R

sensor at the leads were the heat is transferred from the device to the board ( normally at

the widest source or ground lead for GaAs ). Use a small sensor of low heat transport,

for example a thermoelement ( < 1mm ) with thin wires or a temperature indicating paper

while the device is operating.

• When R

thSA

is already known:

Semiconductor Group

3

1998-11-01