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CGY196 Datasheet(PDF) 5 Page - Siemens Semiconductor Group |
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CGY196 Datasheet(HTML) 5 Page - Siemens Semiconductor Group |
5 / 15 page ![]() CGY 196 Siemens Aktiengesellschaft 5 16.6.1998 HL HF PE GaAs c) Reliability Considerations This procedure yields the upper limit for the power dissipation for continuous wave (cw) and pulse applications which corresponds to the maximum allowed channel temperature. For best reliability keep the channel temperature low. The following formula allows to track the individual contributions which determine the channel temperature. Tch = ( Pdiss x RthChS ) + TS Channel temperature (= junction temperature) Power dissipated in the chip. It does not contain decoupled RF- power Rth of device from channel to soldering point Temperature of soldering point, measured or calculated Semiconductor Group 5 1998-11-01 |
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