GS9092A GenLINX® III 270Mb/s Serializer for SDI and

DVB-ASI

Data Sheet

34715 - 4

May 2010

4 of 63

3.10.3 Output Return Loss Measurement ............................................................................ 49

3.11 Programmable Multi-function I/O ........................................................................................ 51

3.12 Low Latency Mode ...................................................................................................................... 52

3.13 GSPI Host Interface ..................................................................................................................... 53

3.13.1 Command Word Description...................................................................................... 54

3.13.2 Data Read and Write Timing....................................................................................... 54

3.13.3 Configuration and Status Registers........................................................................... 56

3.14 JTAG Operation ........................................................................................................................... 57

3.15 Device Power Up ......................................................................................................................... 58

4. References & Relevant Standards ......................................................................................................... 58

5. Application Information .......................................................................................................................... 59

5.1 Typical Application Circuit ........................................................................................................ 59

6. Package & Ordering Information .......................................................................................................... 60

6.1 Package Dimensions ..................................................................................................................... 60

6.2 Recommended PCB Footprint ................................................................................................... 61

6.3 Packaging Data ............................................................................................................................... 61

6.4 Package Marking ........................................................................................................................... 62

6.5 Ordering Information ................................................................................................................... 62

Revision History .............................................................................................................................................. 62